Sanmina Corporation (Sanmina) is a global provider of integrated manufacturing solutions, components, products and repair, logistics and after-market services.
The company provides these comprehensive offerings primarily to original equipment manufacturers (‘OEMs’) in the following industries: industrial, medical, defense and aerospace, automotive, communications networks and cloud infrastructure. The company supports its customers from 21 countries on four continents. The company locates its f...
Sanmina Corporation (Sanmina) is a global provider of integrated manufacturing solutions, components, products and repair, logistics and after-market services.
The company provides these comprehensive offerings primarily to original equipment manufacturers (‘OEMs’) in the following industries: industrial, medical, defense and aerospace, automotive, communications networks and cloud infrastructure. The company supports its customers from 21 countries on four continents. The company locates its facilities near its customers and their end markets in major centers for the electronics industry or in lower-cost locations. The combination of the company’s advanced technologies, extensive manufacturing expertise and economies of scale enables the company to meet the specialized needs of its customers.
The company’s end-to-end solutions, combined with its global supply chain management expertise, allow the company to manage its customers' products throughout their life cycles. These solutions include product design and engineering, including concept development, detailed design, prototyping, validation, preproduction services and manufacturing design release and product industrialization; manufacturing of components, subassemblies and complete systems; high-level assembly and test; direct order fulfillment and logistics services; after-market product service and support; and global supply chain management.
The company manages its operations as two businesses:
Integrated Manufacturing Solutions (‘IMS’). The company’s IMS business consists of printed circuit board assembly and test, high-level assembly and test and direct-order-fulfillment. This segment generated approximately 80% of the company’s total revenue in 2024.
Components, Products and Services (‘CPS’). Components include advanced printed circuit boards (‘PCBs’), backplanes and backplane assemblies, cable assemblies, fabricated metal parts, precision machined parts, and plastic injected molded parts. Products include optical, radio frequency (‘RF’) and microelectronic design and manufacturing services from the company’s Advanced Microsystems Technologies division; multi-chip package memory solutions from the company’s Viking Technology division; high-performance storage platforms for hyperscale and enterprise solutions from the company’s Viking Enterprise Solutions division; defense and aerospace products, design, manufacturing, repair and refurbishment services from the company’s SCI Technology, Inc. (‘SCI’) subsidiary; and cloud-based smart manufacturing execution software from the company’s 42Q division. Services include design, engineering, and logistics and repair. CPS generated approximately 20% of the company’s total revenue in 2024.
The company targets markets that offer significant growth opportunities and in which OEMs sell complex mission critical products that are subject to strict regulatory requirements and/or rapid technological change. These markets offer an opportunity to deliver higher margins as they require higher value-added manufacturing services and provide better opportunities for the company to sell customers its advanced vertically integrated components. In addition, diversification across market segments and customers helps mitigate the company’s dependency on any market or customer. The company reports its end markets as follows:
Industrial, Medical, Defense and Aerospace, and Automotive:
Industrial. Power generation, distribution, storage and controls for grid, data center, commercial and home applications. Industry 4.0 enabling, warehouse and factory asset management equipment, test and measurement systems and connected factory manufacturing software. Next generation semiconductor emulation and fabrication equipment supporting current and next generation artificial intelligence (‘AI’) solutions.
Medical. Disposable, wearable and consumable products supporting glucose sensing, insulin and drug delivery, cancer treatment, diagnostic cartridges and general health monitoring. Lab diagnostic, life sciences, lab processing equipment, high volume automated labs, point of care and personal use devices. Next generation imagining, monitoring and therapeutic delivery systems.
Defense and Aerospace. Federal, regional, municipal and commercial surveillance systems, secure network communication systems and personal protection devices. Federal and commercial manned and unmanned aerospace products.
Automotive and Transportation. Power conversion and battery management for battery electric vehicles and hybrid electric vehicles. Heavy equipment, agricultural, commercial and passenger vehicles. Autonomous, driver assistance and remote control vehicle applications.
Communications Networks and Cloud Infrastructure: Next generation fixed wireless networks. Optical (400G, 800G, 1.6T) shelves, modules and transceivers. Switches, servers, storage, racks and cooling for traditional data centers, edge compute and AI centric data center applications.
Business Strategy
The key elements of the company’s business strategy include capitalizing on the company’s comprehensive solutions; extending the company’s technology capabilities; attracting and retaining long-term customer partnerships; promoting new product introduction (‘NPI’) and joint design manufacturing (‘JDM’) solutions; continuing to penetrate diverse end markets; pursuing strategic transactions; and continuing to seek efficiency improvements.
Products and Solutions
Integrated Manufacturing Solutions includes:
Printed Circuit Board Assembly (‘PCBA’) and Test. To meet the ever-changing needs across the company’s diverse customer base, the company continues to evolve in the support of their requirements. PCBAs are at the core of all electronic systems, and the company continues to work to ensure that its PCBA manufacturing capabilities are aligned with the requirements for such systems. Printed circuit board assembly involves attaching electronic components, such as integrated circuits, capacitors, microprocessors, resistors, memory modules, and connectors to printed circuit boards. The most common technologies used to attach components to printed circuit boards employ surface mount technology (‘SMT’) and pin-through-hole assembly (‘PTH’) and press-fit technology for connectors. The company uses SMT, PTH, press-fit and other attachment technologies focused on miniaturization and increasing the density of component placement on printed circuit boards. These technologies, which support the needs of the company’s customers to provide greater functionality in smaller products, include chip-scale packaging, ball grid array, direct chip attach and high-density interconnect. The company performs in-circuit and functional testing of printed circuit board assemblies. In-circuit testing verifies that all components are properly inserted and attached and that electrical circuits are complete. Functional tests are performed to confirm the board or assembly operates in accordance with its final design and manufacturing specifications. The company designs and procures test fixtures and develop its own test software or use its customers' test fixtures and test software. In addition, the company provides environmental stress tests of the board or assembly that are designed to confirm that the board or assembly will meet the environmental stresses, such as heat, to which it will be subjected.
High-Level Assembly and Test. The company provides high-level assembly and test in which assemblies and modules are combined to form complete, finished products. Examples include complex electro-mechanical assemblies, fluid and blood analysis systems, food dispensing equipment, diagnostic medical devices, high-voltage power management systems, rotating x-ray equipment for airport security, particle analyzers for homeland security and motorized magnetic resonance imaging units. The company’s facilities also support full system level assembly and test and logistic support for a variety of complex electronic systems, including radio base stations and transmission equipment for wireless networks, optical central offices and wireline switching and routing hardware, server and storage systems for data centers, carriers central offices and video streaming service providers, high-volume disposable sensors and drug delivery devices, lab diagnostics, surgical controllers, ultrasound systems, patient monitoring systems, automotive sensor assemblies, and electric vehicle power control systems and modules. These products require highly specialized manufacturing capabilities and processes, as well as integrated IT systems and, in most cases, rigorous regulatory compliance and certifications.
Direct-Order-Fulfillment. The company provides direct-order-fulfillment for its OEM customers. Direct-order-fulfillment involves receiving customer orders, configuring products to quickly fill the orders and delivering the products either to the OEM, a distribution channel, or directly to the end customer. The company manages its direct-order-fulfillment processes using a core set of common systems and processes that receive order information from the customer and provide comprehensive supply chain management, including procurement and production planning. These systems and processes enable the company to process orders for multiple system configurations and varying production quantities including single units. The company’s direct-order-fulfillment services include build-to-order (‘BTO’) and configure-to-order (‘CTO’) capabilities: in BTO, the company builds a system with the particular configuration ordered by the OEM customer; in CTO, the company configures systems to an end customer's order, for example by installing software desired by the end customer. The end customer typically places this order by choosing from a variety of possible system configurations and options. Using advanced manufacturing processes and a real-time warehouse management and data control system on the manufacturing floor, the company can usually meet a 48-to-72 hour turn-around-time for BTO and CTO requests. The company supports its direct-order-fulfillment services with logistics that include delivery of parts and assemblies to the final assembly site, distribution and shipment of finished systems and processing of customer returns.
Components, Products and Services includes:
Product Design and Engineering. The company’s design and engineering groups provide customers with comprehensive services from initial product design and detailed product development to prototyping and validation, production launch and end-of-life support for a wide range of products covering all the company’s market segments. These groups complement the company’s vertically integrated manufacturing capabilities by providing component level design services for printed circuit boards, backplanes and a variety of electro-mechanical systems. The company’s offerings in design engineering include product architecture, detailed development, simulation, test and validation, integration and regulatory and qualification services, and the company’s NPI services include quick-turn prototypes, functional test development and release-to-volume production. The company also offers post-manufacturing and end-of-life support, including repair and sustaining engineering support through the company’s Global Services division. The company can also complement its customer's design team with the company’s unique skills and services which can be used to develop custom, high-performance products that are manufacturable and cost optimized to meet product and market requirements. Such engineering services can help in improving a customer’s time-to-market and cost-to-market objectives.
Printed Circuit Boards. The company produces a wide range of multilayer printed circuit boards on a global basis with high layer counts and fine line circuitry. Specialized production equipment along with an in-depth understanding of high-performance laminate materials allow the company to fabricate some of the largest form factor and highest speed circuit boards in the industry.
The company’s ability to support NPI and quick-turn fabrication followed by manufacturing in both North America and Asia allows the company’s customers to accelerate their time-to-market, as well as their time-to-volume. Standardized processes and procedures make transitioning of products easier for the company’s customers. The company’s field applications engineering personnel support designers with material selection and design for manufacturability advice.
Backplanes and Backplane Assemblies. Backplanes are typically very large printed circuit boards that serve as the backbones of sophisticated electronics products, such as internet routers and switches. Backplane fabrication is significantly more complex than printed circuit board fabrication due to the large size and thickness of the backplanes. The company assembles backplanes by press-fitting high-density connectors into plated through-holes in the fabricated backplane. In addition, many of the newer, advanced technology backplanes require surface-mounted attachment of components, including active high-pin count packages that come in a variety of sophisticated package types. These advanced assembly processes require specialized equipment and a strong focus on quality and process control. The company often performs in-circuit and functional tests on backplane assemblies. The company has capabilities to manufacture backplanes at greater than 60 layers in sizes up to 26x40 inches and up to a nominal thickness of 0.425 inches and in a wide variety of high-performance laminate materials. These are among the largest and most complex commercially manufactured backplanes and the test equipment the company has ensures the quality and performance of these backplane systems is ‘world class’. The company is capable of testing the signal integrity of these backplanes, and often also utilize state of the art x-ray equipment to verify defect-free installation of the new high density/high speed connectors.
Cable Assemblies. Cable assemblies are used to connect modules, assemblies and subassemblies, including backplane assemblies in electronic systems. The company provides a broad range of cable assembly products and services, from cable assemblies and harnesses for automobiles to very complex harnesses for industrial products and semiconductor manufacturing equipment. The company also provides mechanical assembly and integration services where the company often assembles, integrates and tests cables with electromechanical systems or sub-systems. The company designs and manufactures a broad range of high-speed data, radio frequency and fiber optic cabling products. The company builds cable assemblies that are used in power systems typically classified as low and medium voltage.
Fabricated Metal Parts. Parts that are fabricated from metal are often used in sub-assemblies and full enclosures, racks or cabinets used to house and protect complex, critical and fragile electronic components, modules and sub-systems so that the system's functional performance is not compromised due to mechanical, environmental or any other use conditions. The company’s mechanical systems manufacturing services are capable of fabricating mechanical components that range from single parts to complex enclosures, racks or cabinets and the company often integrates these with various electronic components and sub-systems including backplane assemblies and cables with power and thermal management, and other sensor and control systems.
Precision Machined Parts. The company offers a suite of world-class precision machining services in multiple locations. The company uses advanced numerically controlled machines enabling the machining to very tight tolerances and the company often perform further assembly services with these components in clean-room environments. The company’s capabilities include complex medium and large format mill and lathe machining of aluminum, stainless steel, plastics, ferrous and nonferrous alloys and exotic alloys. The company also has helium and hydrostatic leak-test capabilities. By leveraging the company’s established supply chain, the company oversees lapping, anodizing, electrical discharge machining, heat-treating, cleaning, laser inspection, painting and packaging. The company has specialized facilities supporting machining and complex integration with access to a range of state-of-the-art, computer-controlled machining equipment that can satisfy rigorous demands for production and quality and meet very tight tolerance specifications. With some of the largest horizontal milling machines in the U.S., the company is a supplier of vacuum chamber systems for the semiconductor, flat-panel display, LED equipment, industrial, medical and AS9100-certified aerospace markets.
Plastic Injection Molded Parts. Plastic injection molded parts are used to create a vast array of everyday items, from very small intricate plastic parts to enclosures designed to protect sensitive electronic equipment. The company’s diverse capability within the plastic injection molding space spans all major markets and industries. The company is equipped with nearly 80 plastic injection molding machines with a wide variety of clamping pressures. The company’s experienced tooling, process, quality and resin engineers work concurrently using a scientific molding approach to develop cost-effective, highly reliable manufacturing solutions for medical, industrial, defense, multimedia, computing and data storage customers.
Advanced Microsystems Technologies. The company’s Advanced Microsystems Technologies division focuses on optical, RF and microelectronics design and manufacturing services. The company’s mission is to deliver leading-edge technology solutions that enable the company’s customer products while optimizing the value and performance of the company’s customers’ applications.
The company supplies a wide range of optical products from 100G to 1.6T supporting optical communication, AI, high performance computing, quantum computing and data center marketplaces. For the medical end market, the company develops components and subassemblies that support Sanmina’s medical manufacturing operations for products, such as blood analyzers, food contamination analyzers, and specialized optical spectrometers and fluorometers utilizing the latest optical technologies. In the automotive and industrial end markets, the company is working with customers on next generation photonics based LIDAR product offerings.
Viking Technology. The company’s Viking Technology division provides advanced high-technology hardware products, such as Solid-State Drives (SSDs), DRAM memory modules, Non-Volatile DIMMs and the latest Compute Express Link (‘CXL’) attached memory which increases efficiency by allowing composability, scalability, and flexibility for heterogeneous and distributed computer architectures. Furthermore, Viking Technology specializes in delivering state-of-the-art ruggedized Microelectronics Multi-Chip Package (MCP) memory solutions. The compact and rugged design of these MCPs makes them ideal for Size, Weight, and Power (SWaP) optimized applications. Viking Technology product offerings cater to the networking, industrial, transportation, medical, AI, data centers, and defense and aerospace markets.
Viking Enterprise Solutions. The company’s Viking Enterprise Solutions division (‘VES’) is a market leader in high-performance storage platforms for both enterprise and hyperscaler data centers globally. The company’s differentiated nonvolatile memory express (‘NVMe’) flash and disk-based storage solutions enable VES to meet the growing demands for data processing and storage efficiency.
VES provides solutions ideal for a wide range of applications, including rack scale data storage and AI and machine learning workloads. With advances in interconnect speeds and architectural shifts towards disaggregating storage from compute for scalability and efficiency in large data centers, VES is well positioned to take advantage of these trends.
SCI. The company’s SCI subsidiary has provided engineering services, products, manufacturing, test, and depot and repair solutions to the global defense and aerospace industry for more than 60 years. SCI offers advanced products for aircraft systems and tactical communications, unmanned aerial systems and components, counter-unmanned aerial systems and components, and fiber-optics capabilities for use in a variety of defense-related applications.
SCI's customers include the U.S. government agencies, the U.S. allies and major defense and aerospace prime contractors. SCI has the infrastructure and facility security clearance to support the stringent certifications, regulations, processes and procedures required by these customers.
Global Services. Sanmina Global Services complements the company’s end-to-end manufacturing strategy by integrating a full range of post-manufacturing and after-market services, engineering, supply chain, manufacturing, logistics, repair and environmentally friendly disposition into a seamless solution for customers, for both Sanmina-manufactured, and non-Sanmina-manufactured products around the world. The company provides a wide range of services, including new product introduction, high-level assembly, distribution services and warranty management, life-extension services and end-of-life management, as well as programs that focus on reuse, repair, refurbishment, recycle, recover and redesign. The company’s reverse logistics services include detailed failure analysis and feedback to enhance product design and product quality. The company’s IT systems provide full traceability of the product’s lifecycle, from manufacturing and distribution to product returns, the repair process, component swaps and product test results.
42Q. The company’s 42Q division provides an innovative, world-class cloud-based smart manufacturing execution solution that is scalable, flexible, secure and easy to implement. The company’s solution provides customers advantages in efficiencies and costs relative to legacy systems and offers traceability and genealogy, multi-plant visibility, compliance management and on-demand work instructions.
Customers and Marketing
A key component of the company’s strategy is to attract and retain long-term customer partnerships with leading companies in growth industries that will benefit from the company’s global/regional footprint and unique value proposition in advanced electronics manufacturing. The company develops relationships with its customers and markets its vertically integrated manufacturing solutions through the company’s sales and marketing staff. The company’s sales team works with its customers' engineering and technical personnel to understand their strategy and roadmaps to enable their go-to-market strategy. The company’s sales and marketing staff supports its business strategy of providing end-to-end solutions by encouraging cross-selling vertically integrated manufacturing solutions and component manufacturing across a broad range of major OEM products. The company utilizes its existing technical capabilities in design, technology components, and complex assembly, integration, and after-sales services to provide tailored solutions to the company’s customers. With the company’s extensive market knowledge and global/regional footprint, the company can align these solutions to the company’s facilities in each region around the world.
Sales to the company’s ten largest customers represented 47% of the company’s net sales in 2024. Motorola represented 10% or more of the company’s net sales in 2024.
The company typically enters into supply agreements with its major OEM customers with terms ranging from three to five years.
Research and Development
The company's research and development expenses were $29 million in 2024.
Intellectual Property
The company holds the U.S. and foreign patents and patent applications relating to, among other things, printed circuit board manufacturing technology, enclosures, cables, memory modules, optical technology, medical devices and computing and storage. For other proprietary processes, the company relies primarily on trade secret protection. A number of the company’s patents have expired or will expire in the near term. The expiration and abandonment of patents reduces the company’s ability to assert claims against competitors or others who use similar technologies and to license such patents to third parties. The company has registered a number of trademarks and has pending trademark applications in both the U.S. and internationally. Sanmina, Viking, Viking Enterprise Solutions, Viking Technology and 42Q are registered trademarks of the company.
Compliance with Government Regulations
Environmental Regulations
The company monitors for airborne concentrations of lead in its buildings and are unaware of any significant lead concentrations in excess of the applicable Occupational Safety & Health Administration (OSHA) or other local standards.
Almost all of the company's manufacturing facilities are certified under ISO 14001, a set of standards and procedures relating to environmental compliance management. The company has implemented procedures intended to ensure its manufacturing processes are compliant with Restrictions of Hazardous Substances (RoHS) and the European Union's Registration, Evaluation and Authorization of Chemicals (REACH) legislation, when required.
The company is also subject to a number of domestic and foreign regulations relating to its operations worldwide. In particular, its sales activities must comply with restrictions relating to the export of controlled technology and sales to denied or sanctioned parties contained in the U.S. International Traffic in Arms Regulations (ITAR), the U.S. Export Administration Regulations and sanctions administered by the Office of Foreign Asset Controls of the U.S. Treasury Department (OFAC).
Finally, the design, manufacture and repair of products that the company conducts for the medical industry often requires compliance with domestic and foreign regulations, including the Food and Drug Administration's (FDA's) quality system regulations and the European Union's medical device directive. In addition to complying with these standards, the company's medical facilities comply with ISO 13485 and ISO 9001, where required.
In the U.S., the company is subject to the requirements of the United States Department of Labor's Occupational Safety & Health Administration (OSHA) and it is guided by the Environmental Health and Safety principles as described in the Responsible Business Alliance's (RBA's) Code of Conduct worldwide.
History
Sanmina Corporation was founded in 1980. The company was incorporated in 1980 and reincorporated in Delaware in 1989.
